Mechanical Engineer - Bangalore - Cisco
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What You'll Do
The HW organization in Cisco Bangalore is developing next generation networking architectures for all major Service Provider (SP) networks.
Who you’ll Work With
The mechanical & thermal team is an integrated part of HW organization, responsible of varieties of complex electro-mechanical designs which includes but not limited to central office networking products (product ranges from 1RU to 40RU sizes), outdoor mobility equipment, high performance thermal solutions and complex PCB assemblies. We are looking for exceptional mechanical engineer to help in these development activities, who are passionate about electro-mechanical packaging design and thermal/flow sciences and like to work on next-generation innovative solutions to deliver on best in class networking products.
Who You Are
BS/MS/PhD in mechanical engineering with 5 – 8 years of work experience in electro-mechanical packaging of standalone and rack mount chassis systems used in telecom industries. As a member of a cross-functional team, will be responsible for initial chassis concept/architecture, establishing optimized printed circuit board (PCB) size(s) and outline, developing sheet-metal enclosures to meet intended performance and cost targets, power shelf and power distribution design. Perform detailed MCAD product layout studies to ensure project objectives are met and work on the detail fabrication drawings (sheet-metal, plastic, cable, labels, etc.) and assembly drawings required for project prototype release. Special emphasis on product design for low cost (high volume) and ease of manufacture is required. People management experience is an added advantage.
• Pro-Engineer mechanical design expertise is a must
• Good command on tolerance analysis and DFM/DFA concepts
• Good understanding of thermal engineering design concepts. Thermal simulation & validation experience would be an added advantage.
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